Copyright © 2022, IEEEAllal, D.Bannister, R.Buisman, K.Capriglione, D.Di Capua, G.García Patrón Mendiburu, MartínGatzweiler, T.Gellersen, F.Harzheim, T.Heuermann, H.Hoffmann, J.Izbrodin, A.Kuhlmann, K.Lahbacha, K.Maffucci, A.Miele, G.Mubarak, F.Salter, M.Pham, T. D.Sayegh, A.Singh, D.Stein, F.Zeier, M.2023-01-132023-01-132022-07-20Proceedings of the IEEE International Symposium on Measurements and Networking 202297816654836292639-507Xhttps://ieeexplore.ieee.org/document/9887740http://hdl.handle.net/20.500.12666/832In this paper research activities developed within the FutureCom project are presented. The project, funded by the European Metrology Programme for Innovation and Research (EMPIR), aims at evaluating and characterizing: (i) active devices, (ii) signal- and power integrity of field programmable gate array (FPGA) circuits, (iii) operational performance of electronic circuits in real-world and harsh environments (e.g. below and above ambient temperatures and at different levels of humidity), (iv) passive inter-modulation (PIM) in communication systems considering different values of temperature and humidity corresponding to the typical operating conditions that we can experience in real-world scenarios. An overview of the FutureCom project is provided here, then the research activities are described.engFPGASignal integrityPower integrityPassive inter-modulationMetrological characterizationinfo:eu-repo/semantics/conferenceObject2639-5061info:eu-repo/semantics/restrictedAccess